The ways of wave soldering dross are as follows:

Tin dross

1. The larger the contact area of the molten high-temperature tin with air in the wave soldering, the larger the tin oxide. The contact area with air refers to the opening area of the wave soldering furnace. The opening area of the wave soldering furnace is large. The molten tin naturally interacts with the air. The contact area of the wave soldering nozzle is large; the width and height of the spraying tin of the wave soldering nozzle, the width of the circuit board and the long-foot operation, then the wave soldering nozzle must be widened, and the spraying height must be adjusted to the highest possible level, so that the tin can be melted. The contact area with the air will become larger, so that the tin oxide dross will naturally increase.

Solution: 1. In response to this situation, Guangshengde wave soldering will only position the technical parameters of the wave soldering spray height to 0~12mm. It is recommended that customers work with short feet when soldering (that is, the feet of the device should be trimmed and shortened before the plug-in. ); 2, Guangshengde made the width of the opening area of the wave soldering furnace smaller than those of other companies, thereby reducing the contact area of the entire molten tin and air; 3. Guangshengde wave soldering at the nozzle of the tin furnace Special treatment has been done to make the width of the nozzle adjusted with the width of the circuit board. As wide as the circuit board is, the nozzle of the tin furnace will be sprayed as wide as possible to reduce the contact area between the spray tin and the air, which reduces the tin The generation of slag.

Guangshengde wave solder spray nozzle

2. The tin liquid raised by the wave front of the wave soldering falls into the tin liquid in the tin furnace and also brings the air to the tin liquid surface, which cannot be eliminated in time, so that the molten tin wraps the air and produces a large amount in the tin liquid. Semi-tin oxide (also known as tofu residue tin)

Solution: In response to this situation, Guangshengde wave soldering made a blocking device after the molten tin wave peak fell into the middle of the tin surface to prevent the tin liquid from directly rushing into the tin furnace to buffer the impact of the tin liquid falling, thereby also Will not let the molten tin carry air directly into the tin liquid of the wave soldering furnace, thus greatly reducing the generation of semi-oxide slag;

Guangshengde wave soldering diversion tin bath

3. The long-term friction between the wave source generators on the two high-temperature motors in the wave soldering furnace and the molten tin produces a large amount of tin oxide ash. Such tin ash is completely scrapped, and the tin slag cannot be reduced.

Solution: Guangshengde wave soldering installed a high-temperature resistant metal sleeve on the wave source generator of the wave soldering furnace, which also blocked the friction between the wave source generator and the molten tin, thus preventing the generation of wave solder ash.

Anti-oxidation cover for wave soldering

Fourth, the copper on the surface of the printed circuit board and the copper on the pins of the electronic components will continuously dissolve into the molten solder. The Cu6Sn5 intermetallic compound is formed between copper and tin. The melting point of this compound is above 500°C, so it exists in a solid form. At the same time, since the density of the compound is 8.28g/cm3, and the density of the Sn63Pb37 solder bar is 8.80g/cm3, the compound generally floats on the surface of the liquid solder in the form of tofu.

Solution: The work of removing copper is very important. The operation is as follows: stop the wave crest, and the heating device of the tin furnace operates normally. First, clean up the various residues on the surface of the tin furnace to expose the mercury-like mirror surface. Then lower the temperature of the tin furnace to 190-200°C (the solder is still in liquid state), and then stir the solder with an iron spoon and other tools for 1-2 minutes to help the tin-copper compound inside the solder float and then stand for 3-5 hours. Due to the low density of the tin-copper compound, the tin-copper compound will naturally float on the solder surface after standing still. At this time, the tin-copper compound on the surface can be cleaned up with tools such as an iron spoon.